COOLING PLATE FOR SEMICONDUCTOR ELEMENT, MANUFACTURING METHOD OF COOLING PLATE FOR SEMICONDUCTOR ELEMENT, AND METHOD FOR INSTALLING SEMICONDUCTOR ELEMENT ONTO COOLING PLATE FOR SEMICONDUCTOR ELEMENT

摘要

PROBLEM TO BE SOLVED: To facilitate alignment of a semiconductor element and a radiation pin when installing the semiconductor element on a surface opposite to the surface on which the radiation pin is protrusively provided.;SOLUTION: A substrate 1 is formed and in the substrate, a block 3b for which a contour of a plate part 3 is made small and which is formed rectangular in a plan view, protrudes from a center of one face 3a of the plat part 3 which is formed rectangular in a plan view. In a portion of the plate part 3 excluding a protruding part of the block 3b, two positioning holes 3c and 3c are formed. Two positioning pins 5c that are protrusively provided on a table surface 5b of a rotary table 5a of a cutting machine 5 are inserted into the positioning holes 3c, and the block 3b is cut in orthogonal two directions by a multi-cutter 7 of the cutting machine 5. Thus, multiple pins 3e are formed in a predetermined region of which the positional relationship to the face 3a with the positioning holes 3c defined as references becomes a predetermined positional relationship, such that a cooling plate for semiconductor element is manufactured.;SELECTED DRAWING: Figure 4;COPYRIGHT: (C)2018,JPO&INPIT