Ni-COATED COPPER POWDER, AND CONDUCTIVE PASTE, CONDUCTIVE PAINT AND CONDUCTIVE SHEET USING THE SAME, AND METHOD FOR PRODUCING Ni-COATED COPPER POWDER

摘要

PROBLEM TO BE SOLVED: To provide a dendritic Ni-coated copper powder capable of preventing agglomeration, thereby being suitably used for conductive pastes, electromagnetic shields or the like, while increasing the number of contact points when Ni- or Ni alloy-coated dendritic copper powders contact with one another to ensure excellent conductivity.;SOLUTION: An Ni-coated copper powder according to the present invention is formed by agglomerating copper particles 1 having: a trunk 2 dendritically grown; and a plurality of branches 3 diverged from the trunk 2, wherein the copper powder has a surface coated with Ni or Ni alloy. The trunk 2 and the branches 3 of the copper particles 1 are in a plate shape having an average cross-sectional thickness of 0.02 to 0.5 μm. An average particle diameter (D50) of the Ni-coated copper powder is 1.0 to 30 μm.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2017,JPO&INPIT