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System and method for reducing system-on-chip leakage power using integrated thermoelectric cooling

机译:使用集成热电冷却降低芯片上系统泄漏功率的系统和方法

摘要

A system, method, and computer program for reducing system-on-chip (SoC) leakage power are disclosed. One such method includes monitoring a plurality of temperature differences across each plurality of thermoelectric coolers on a system on chip (SoC). Each thermoelectric cooler is dedicated to a corresponding one of multiple chip sections on the SoC. The thermoelectric cooler is controlled based on the temperature differences to minimize the sum of the combined power consumption of the chip sections and the corresponding dedicated thermoelectric coolers.
机译:公开了一种用于减少片上系统(SoC)泄漏功率的系统,方法和计算机程序。一种这样的方法包括监视片上系统(SoC)上的每个多个热电冷却器上的多个温度差。每个热电冷却器专用于SoC上多个芯片部分中的相应一个。基于温度差控制热​​电冷却器,以最小化芯片部分和相应的专用热电冷却器的总功耗之和。

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