首页> 外国专利> SYSTEMS AND METHODS FOR REDUCING LEAKAGE POWER OF A SYSTEM ON CHIP WITH INTEGRATED THERMOELECTRIC COOLING

SYSTEMS AND METHODS FOR REDUCING LEAKAGE POWER OF A SYSTEM ON CHIP WITH INTEGRATED THERMOELECTRIC COOLING

机译:集成热电冷却降低芯片上系统泄漏功率的系统和方法

摘要

Systems, methods, and computer programs for reducing the leakage power of a system-on-chip (SoC) are disclosed. One such method involves monitoring a plurality of temperature differences across each of a plurality of thermoelectric coolers on a system-on-chip (SoC). Each of the thermoelectric coolers is dedicated to a corresponding one of a plurality of chip sections on the SoC. The thermoelectric coolers are controlled based on the plurality of temperature differences to minimize the sum of the combined power consumption of the plurality of chip sections and the plurality of corresponding dedicated thermoelectric coolers.
机译:公开了用于减少片上系统(SoC)的泄漏功率的系统,方法和计算机程序。一种这样的方法涉及监视片上系统(SoC)上的多个热电冷却器中的每一个上的多个温差。每个热电冷却器专用于SoC上多个芯片部分中的相应一个。基于多个温度差来控制热电冷却器,以使多个芯片部分和多个对应的专用热电冷却器的组合功耗的总和最小。

著录项

  • 公开/公告号KR20170037609A

    专利类型

  • 公开/公告日2017-04-04

    原文格式PDF

  • 申请/专利权人 퀄컴 인코포레이티드;

    申请/专利号KR20177002228

  • 发明设计人 미탈 라자트;박 희준;강 영훈;

    申请日2015-07-22

  • 分类号G06F1/20;G05D23/19;G06F1/32;

  • 国家 KR

  • 入库时间 2022-08-21 13:27:47

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