STRUCTURE FOR REDUCING THERMAL STRAIN IN COMPOSITE MATERIAL STRUCTURE

摘要

PROBLEM TO BE SOLVED: To solve such problems that, since a composite material tool is constituted by different materials for layers of the tool so as to improve thermal conductivity or the like, thermal expansion of each layer is different from others, which induces deformation by a cantilever effect when the layers are connected and that the deformation brings difficulty in fixing a component having high accuracy.SOLUTION: A thermal strain between layers is eliminated by using, in an outer peripheral part (1-2) of an upper layer, a substrate of the same material as a lower layer (2) just below the upper layer so as to eliminate a thermal strain in a connecting part between the lower layer (2) and the upper layer (1-2) (however, when the temperature is uniform, no strain is induced). The layers have such a structure that an inner substrate (1-1) of the upper layer is held by the outer substrate (1-2) by using a resin film (1-3), such as PTFE, polyimide and PEEK, having heat resistance and easily slipping property, so as to absorb a difference in a deformation amount between deformations of the lower layer (2) and the upper layer (1) by the slippage therebetween. Thereby, deformation due to a cantilever effect can be prevented.SELECTED DRAWING: Figure 2