Highly scalable manufacturing technology and packaging devices for electronic circuits

摘要

Disclosed are methods for manufacturing highly scalable electronic circuits, devices and systems. In one aspect, a manufacturing method accommodates an electronic component by attaching the electronic component to a location on a substrate that includes a flexible electrically insulating material and depositing the electronic component and a phase material that conforms to the surface of the substrate. Forming a template, changing the material to a solid state, forming an opening in the substrate, exposing a conductive portion of the electronic component, and connecting to at least some of the conductive portions in a selected configuration of the substrate Creating a circuit or electronic device housed in a template by forming an interconnect and depositing a layer of electrically insulating flexible material on the electrical interconnect on the substrate to form a flexible base of the circuit And including. [Selection] Figure 1