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Method for producing a dendritic silver-coated copper powder, and dendritic silver-coated copper powder with copper paste using, conductive paint, conductive sheet

机译:导电涂料,导电片的树枝状镀银铜粉的制造方法以及具有铜糊剂的树枝状镀银铜粉

摘要

PROBLEM TO BE SOLVED: To provide a method for producing silver coat copper powder, in dendritic silver coat copper powder, capable of industrially efficiently controlling a specific surface area value to a suitable range at a low cost.;SOLUTION: Provided is a method for producing dendritic silver coat copper powder comprising: a step where dendritic copper powder is precipitated from a sulfuric acid acidic solution to the surface of the cathode by an electrolytic process; and a step where the dendritic copper powder is coated with silver, in which the sulfuric acid acidic solution includes: copper ions; and an alkylene oxide derivative of 1 to 10,000 mg/L.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2017,JPO&INPIT
机译:解决的问题:提供一种在树枝状的银涂层铜粉中生产银涂层铜粉的方法,该方法能够在工业上低成本有效地将比表面积值控制在合适的范围内。制备树枝状银涂层铜粉,包括:通过电解工艺将树枝状铜粉从硫酸酸性溶液中沉淀到阴极表面上的步骤;在树状铜粉上涂布银的步骤,其中硫酸酸性溶液包括:铜离子;和环氧烷衍生物的量为1至10,000 mg / L .;部分附图:图1;版权:(C)2017,JPO&INPIT

著录项

  • 公开/公告号JP6056901B2

    专利类型

  • 公开/公告日2017-01-11

    原文格式PDF

  • 申请/专利权人 住友金属鉱山株式会社;

    申请/专利号JP20150093084

  • 发明设计人 岡田 浩;

    申请日2015-04-30

  • 分类号C25C5/02;B22F1/00;B22F1/02;H01B13/00;H01B5/00;H01B1/00;H01B1/22;C23C18/42;

  • 国家 JP

  • 入库时间 2022-08-21 13:57:33

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