Method for manufacturing flexible structure, intermediate structure, and flexible structure

摘要

The method involves implanting ionic species in source substrate to form embrittlement regions (3.5, 4.6) delimiting a second thin film (4). The first thin film (3) and second thin film are secured to the first and second face of the flexible substrate (9) to form a stack (12) including the flexible structure (13) delimited by the embrittlement regions. The flexible structure includes a stiffening effect suitable for allowing transfers of the first and second thin films. A fracture thermal budget is applied for transferring the first and second thin films onto the flexible substrate. The primary and secondary stiffening films have a thickness comprised between 0.1 micrometers and 30 micrometers. Young's modulus greater than or equal to 10 grade point average (GPa). The flexible substrate is selected from a group consisting of metal sheets, rubber polymers, glassy polymers such as Kapton(RTM: polyimide film). INDEPENDENT CLAMIS are also included for the following: (1) an intermediate structure (2) a flexible structure suitable for being grasped for applying micro-technology, microelectronics and cleaning step.