QUALITY JUDGMENT DEVICE, WIRE BONDER DEVICE, AND QUALITY JUDGMENT METHOD

摘要

PROBLEM TO BE SOLVED: To judge a bonding quality of wire bonding with high accuracy.SOLUTION: A pass/fail judging device 2 for judging whether or not bonding of wire bonding is good in accordance with an output signal at the time of joining wires obtained from a wire bonder device comprises an acquiring unit (31) for acquiring a captured image of the joining portion from the wire bonder device, a classification unit (32) for classifying the captured image into a plurality of categories on the basis of a predetermined index, a selection unit (33) for selecting a reference waveform associated with a category to which the captured image belongs, and a judgment unit (36) for judging whether the junction is good or bad according to a result of comparison between the target waveform of the output signal at the time of joining the joining portion and the reference waveform.SELECTED DRAWING: Figure 5