Pad array structure on substrate for mounting IC chip on substrate, and optical module having said pad array structure

摘要

In the pad array arrangement structure on the substrate for mounting the IC chip on the substrate, by devising the pad arrangement in the pad array area for IC, a structure that can avoid the multilayer wiring on the substrate as much as possible is realized. . Embodiments of the present invention provide a pad array structure on a substrate for mounting an IC chip on the substrate. A plurality of ground pads arranged at equal intervals in the first row at the first peripheral edge of the pad array region, and at equal intervals in a second row inside the first row and parallel to the first row; A plurality of signal pads arranged, and each signal pad is connected to an external circuit on the substrate through two adjacent ground pads in the first row, and an electrical signal is transmitted to the external circuit. Is input / output.