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Cut-out device of the optical film chips, optical film chip cut-out method of manufacturing system and an optical film chip

机译:光学膜片的切出装置,光学膜片的切出方法,制造系统以及光学膜片

摘要

PROBLEM TO BE SOLVED: To provide an optical film chip cut-out device, a manufacturing system of the optical film chip and a cut-out method of the optical film chip that allow reduction in variations of optical axes among respective optical film chips.SOLUTION: An optical film chip cut-out device 12 that cuts out a plurality of optical film chips from an optical film F comprises: a controller 10 that adjusts a cut-out direction of the optical film F such that an average direction of an in-plane optical axis of the optical film F forms a target angle with respect to the cut-out direction of the optical film F; a first cut-out device 5 that cuts out the optical film F with an adjusted direction to thereby cut out an optical film intermediate from the optical film F; and a second cut-out device 6 that cuts out the optical film intermediate with a first direction in parallel with a cut-out side of the optical film intermediate and a second direction orthogonal to the first direction to thereby cut out the plurality of optical film chips from the optical film intermediate.
机译:要解决的问题:提供一种光学膜片切出装置,该光学膜片的制造系统以及该光学膜片的切出方法,以减少各个光学膜片之间的光轴变化。 :从光学膜F中切出多个光学膜片的光学膜片切出装置12包括:控制器10,其调节光学膜F的切出方向,以使光学膜片F的切入方向为平均方向。光学膜F的平面光轴相对于光学膜F的切出方向形成目标角度。第一切出装置5,以调整后的方向切出光学膜F,从而从光学膜F中切出中间的光学膜。第二切出装置6,其以与光学膜中间体的切出侧平行的第一方向和与第一方向正交的第二方向平行的方式切出光学膜中间体,从而切出多个光学膜。光学膜片中间的碎片。

著录项

  • 公开/公告号JP6069842B2

    专利类型

  • 公开/公告日2017-02-01

    原文格式PDF

  • 申请/专利权人 住友化学株式会社;

    申请/专利号JP20120024970

  • 发明设计人 藤井 幹士;

    申请日2012-02-08

  • 分类号G02B5/30;

  • 国家 JP

  • 入库时间 2022-08-21 13:54:57

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