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METHOD FOR MODIFYING AN ELECTRICALLY CONDUCTIVE OXIDE SURFACE, USE FOR ELECTRODEPOSITION OF COPPER ON SAID SURFACE

机译:修饰导电氧化物表面的方法,用于在所述表面上电沉积铜

摘要

The present invention relates to a method for modifying the surface of a substrate made of electrically conductive metal oxide and notably made of ITO, comprising the following steps consisting in: (i) bringing into contact said surface with a solution containing copper ions (Cu2+) and ammonia then washing and optionally drying the surface thus obtained; and (ii) bringing into contact the surface obtained following step (i) with a solution containing sodium tetraborohydride then washing and optionally drying the surface of said conductive metal oxide substrate. The present invention relates to the use of such a method within the scope of the metallisation by copper of a conductive metal oxide substrate as well as the surfaces of a modified and metallised conductive metal oxide substrate thus obtained.
机译:本发明涉及一种用于修饰由导电金属氧化物制成并且尤其是由ITO制成的基板的表面的方法,该方法包括以下步骤:(i)使所述表面与包含铜离子(Cu < (Sup> 2 + )和氨水,然后洗涤并任选干燥由此得到的表面; (ii)使步骤(i)后得到的表面与含有四硼氢化钠的溶液接触,然后洗涤并任选干燥所述导电金属氧化物基材的表面。本发明涉及在导电金属氧化物基底的铜的金属化以及如此获得的改性和金属化的导电金属氧化物基底的表面的范围内这种方法的用途。

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