首页>
外国专利>
SEMICONDUCTOR MEMORY DEVICE FOR IMPROVING SIGNAL INTEGRITY ISSUE IN CENTER PAD TYPE OF STACKED CHIP STRUCTURE
SEMICONDUCTOR MEMORY DEVICE FOR IMPROVING SIGNAL INTEGRITY ISSUE IN CENTER PAD TYPE OF STACKED CHIP STRUCTURE
展开▼
机译:改善芯片堆叠结构中心垫式中信号完整性问题的半导体存储器
展开▼
页面导航
摘要
著录项
相似文献
摘要
A semiconductor memory device includes a first memory die having a first termination resistor for an on-die termination and a second memory die having a second termination resistor for an on-die termination and formed on the first memory die. Each of the first and second memory dies has a center pad type and operates based on a multi-rank structure. When the first memory die is accessed, the second termination resistor is connected to the second memory die, and when the second memory die is accessed, the first termination resistor is connected to the first memory die.
展开▼