首页> 外国专利> HIGH-EFFICIENCY MICROSTRUCTURED SEMICONDUCTOR NEUTRON DETECTORS AND PROCESS TO FABRICATE HIGH-EFFICIENCY MICROSTRUCTURED SEMICONDUCTOR NEUTRON DETECTORS

HIGH-EFFICIENCY MICROSTRUCTURED SEMICONDUCTOR NEUTRON DETECTORS AND PROCESS TO FABRICATE HIGH-EFFICIENCY MICROSTRUCTURED SEMICONDUCTOR NEUTRON DETECTORS

机译:高效微结构半导体中子检测器和制造高效微结构半导体中子检测器的过程

摘要

A semiconductor neutron detector and a semiconductor process is provided to manufacture a semiconductor neutron detector. First, a substrate with flat surface having a dielectric layer is formed thereon is provided. Thereafter, a masking pattern is applied and etched into the dielectric layer to expose semiconductor features on opposite sides of the substrate. The semiconductor substrate is submerged into an etchant composed of a semiconductor etching solution to etch deep cavities into the substrate in the exposed regions. Afterwards, dopant impurities are introduced and are driven into the semiconductor, under high temperature, into opposite sides of the etched features to produce one or more rectifying junctions. Afterwards, LiF and/or B particles are forced into the cavities through high velocity methods.
机译:提供一种半导体中子探测器和半导体工艺,以制造半导体中子探测器。首先,提供其上形成有具有介电层的平坦表面的基板。此后,施加掩模图案并将其蚀刻到介电层中以在衬底的相对侧上暴露半导体特征。将半导体衬底浸入由半导体蚀刻溶液组成的蚀刻剂中,以在暴露区域中将深腔蚀刻到衬底中。之后,将掺杂物杂质引入并在高温下驱入半导体中,进入蚀刻特征的相对侧,以产生一个或多个整流结。然后,通过高速方法将LiF和/或B颗粒压入空腔。

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