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HIGH-EFFICIENCY MICROSTRUCTURED SEMICONDUCTOR NEUTRON DETECTORS AND PROCESS TO FABRICATE HIGH-EFFICIENCY MICROSTRUCTURED SEMICONDUCTOR NEUTRON DETECTORS
HIGH-EFFICIENCY MICROSTRUCTURED SEMICONDUCTOR NEUTRON DETECTORS AND PROCESS TO FABRICATE HIGH-EFFICIENCY MICROSTRUCTURED SEMICONDUCTOR NEUTRON DETECTORS
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机译:高效微结构半导体中子检测器和制造高效微结构半导体中子检测器的过程
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摘要
A semiconductor neutron detector and a semiconductor process is provided to manufacture a semiconductor neutron detector. First, a substrate with flat surface having a dielectric layer is formed thereon is provided. Thereafter, a masking pattern is applied and etched into the dielectric layer to expose semiconductor features on opposite sides of the substrate. The semiconductor substrate is submerged into an etchant composed of a semiconductor etching solution to etch deep cavities into the substrate in the exposed regions. Afterwards, dopant impurities are introduced and are driven into the semiconductor, under high temperature, into opposite sides of the etched features to produce one or more rectifying junctions. Afterwards, LiF and/or B particles are forced into the cavities through high velocity methods.
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