首页> 外国专利> Reducing hot electron injection type of read disturb during read recovery phase in 3D memory

Reducing hot electron injection type of read disturb during read recovery phase in 3D memory

机译:在3D存储器的读取恢复阶段减少热电子注入类型的读取干扰

摘要

A memory device and associated techniques for reducing read disturb of memory cells during the last phase of a sensing operation when all voltage signals are ramped down to a steady state voltage. In one aspect, the voltages of the source side word line, WL0, and an adjacent dummy word line, WLDS1, are ramped down after the voltages of remaining word lines are ramped down. This can occur regardless of whether WL0 is the selected word line which is programmed or read. The technique can be applied after the sensing which occurs in a read or program-verify operation. Another option involves elevating the voltage of the selected word line so that all word lines are ramped down from the same level, such as a read pass level. The techniques are particularly useful when the memory device includes an interface in the channel between epitaxial silicon and polysilicon.
机译:当所有电压信号都下降到稳态电压时,用于在感测操作的最后阶段减少存储单元的读取干扰的存储设备和相关技术。一方面,源侧字线WL 0 和相邻的伪字线WLDS 1 的电压在其余字线的电压下降之后下降。被降低。无论WL 0 是被编程还是读取的所选字线,都可能发生。该技术可以在读取或编程验证操作中发生的感测之后应用。另一种选择涉及升高所选字线的电压,以使所有字线从相同的电平(例如,读取通过电平)下降。当存储器件在外延硅和多晶硅之间的通道中包括接口时,该技术特别有用。

著录项

  • 公开/公告号US9761320B1

    专利类型

  • 公开/公告日2017-09-12

    原文格式PDF

  • 申请/专利权人 SANDISK TECHNOLOGIES LLC;

    申请/专利号US201615383852

  • 发明设计人 HONG-YAN CHEN;CHING-HUANG LU;WEI ZHAO;

    申请日2016-12-19

  • 分类号G11C16/04;G11C16/34;G11C16/28;G11C16/16;G11C16/10;

  • 国家 US

  • 入库时间 2022-08-21 13:48:24

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