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STRAIN ENGINEERING DEVICES USING PARTIAL DEPTH FILMS IN THROUGH-SUBSTRATE VIAS
STRAIN ENGINEERING DEVICES USING PARTIAL DEPTH FILMS IN THROUGH-SUBSTRATE VIAS
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机译:贯穿基体的部分深度薄膜应变工程设备
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摘要
Through-substrate vias (TSVs) include a strain engineering layer configured to minimize or otherwise control local stress fields. The strain engineering layer can be separate from and in addition to a TSV sidewall isolation layer that is deposited along the via sidewall surface for the purpose of electric isolation. For instance, the strain engineering layer can be a partial depth layer that extends over only a portion of the TSV sidewall.
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