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LASER DIRECT IMAGING SYSTEM AND METHOD FOR SOLDER MASK EXPOSURE

机译:激光直接成像系统和阻焊剂曝光方法

摘要

A laser direct imaging system includes a stage, a laser device and an oxygen-reducing device. The stage is subjected to an atmospheric pressure. The laser device is configured to provide a laser beam to scan across the substrate. The oxygen-reducing device operates simultaneously with the laser device for outputting an inert gas only to a specific area where the laser beam is being aimed such that any portion of the substrate, if enters the specific area, will be exposed to the laser beam under a low-oxygen environment.
机译:激光直接成像系统包括平台,激光装置和氧减少装置。该台承受大气压。激光装置被配置为提供激光束以扫描整个衬底。氧气减少装置与激光装置同时工作,以仅将惰性气体输出到激光束所瞄准的特定区域,这样,基板的任何部分(如果进入该特定区域)将在下面暴露于激光束中。低氧环境。

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