EMI shielding structure to enable heat spreading and low cost assembly

摘要

Methods and apparatus relating to EMI (Electromagnetic Interference) shielding structure to enable heat spreading and/or low cost assembly are described. In an embodiment, a metallic shield at least partially surrounds at least one logic component. The metallic shield includes a dome feature to provide thermal contact between the at least one logic component and the metallic shield. Other embodiments are also disclosed and claimed.