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Method and apparatus for determining an actual junction temperature of an IGBT device
Method and apparatus for determining an actual junction temperature of an IGBT device
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机译:确定IGBT器件的实际结温的方法和装置
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摘要
The present invention relates to a method for determining an actual junction temperature (Tj) and/or an actual collector current (IC) of an IGBT device, wherein the IGBT device has a main emitter (EM) and an auxiliary emitter (EA), comprising the steps of;measuring the characteristics of an emitter voltage drop (VEE′) as a difference between a main emitter voltage (VE) at the main emitter (EM) and an auxiliary emitter voltage (VE′) at the auxiliary emitter (EA) during a switching operation of the IGBT device; anddetermining the junction temperature and/or the collector current (IC) based on the characteristics of the emitter voltage drop (VEE′).展开▼
机译:确定IGBT器件的实际结温(T j Sub>)和/或实际集电极电流(I C Sub>)的方法技术领域该设备具有主发射器(E M Sub>)和辅助发射器(E A Sub>),包括以下步骤:测量发射器电压降(V EE' Sub>)的特性,作为主发射器上的主发射器电压(V E Sub>)之间的差( E M Sub>)和IGBT器件开关操作期间辅助发射极(E A Sub>)的辅助发射极电压(V E' Sub>) ;和 ListItem> ,根据发射极电压降的特性确定结温和/或集电极电流(I C Sub>) (V EE' Sub>)。 ListItem> UnorderedList> ListItem> UnorderedList>
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