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Method and apparatus for determining an actual junction temperature of an IGBT device

机译:确定IGBT器件的实际结温的方法和装置

摘要

The present invention relates to a method for determining an actual junction temperature (Tj) and/or an actual collector current (IC) of an IGBT device, wherein the IGBT device has a main emitter (EM) and an auxiliary emitter (EA), comprising the steps of;measuring the characteristics of an emitter voltage drop (VEE′) as a difference between a main emitter voltage (VE) at the main emitter (EM) and an auxiliary emitter voltage (VE′) at the auxiliary emitter (EA) during a switching operation of the IGBT device; anddetermining the junction temperature and/or the collector current (IC) based on the characteristics of the emitter voltage drop (VEE′).
机译:确定IGBT器件的实际结温(T j )和/或实际集电极电流(I C )的方法技术领域该设备具有主发射器(E M )和辅助发射器(E A ),包括以下步骤: 测量发射器电压降(V EE')的特性,作为主发射器上的主发射器电压(V E )之间的差( E M )和IGBT器件开关操作期间辅助发射极(E A )的辅助发射极电压(V E') ;和 ,根据发射极电压降的特性确定结温和/或集电极电流(I C ) (V EE')。

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