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Optimized wires for resistance or electromigration

机译:针对电阻或电迁移的优化电线

摘要

Optimized metal wires for resistance or electromigration, methods of manufacturing thereof and design methodologies are disclosed. The method includes depositing metal material within openings and on a surface of dielectric material resulting in metal filled openings and a topography of recessed areas aligned with the metal filled openings. The method further includes depositing an alloying material over the metal material, including within the recessed areas. The method further includes planarizing the metal material, leaving the alloying material within the recessed areas. The method further includes diffusing the alloying material into the metal material forming alloyed regions self-aligned with the metal filled openings.
机译:公开了用于电阻或电迁移的优化金属线,其制造方法和设计方法。该方法包括在开口内和介电材料的表面上沉积金属材料,从而形成金属填充的开口以及与金属填充的开口对准的凹陷区域的形貌。该方法还包括在金属材料上,包括在凹进区域内沉积合金材料。该方法还包括使金属材料平坦化,将合金材料留在凹陷区域内。该方法还包括将合金材料扩散到金属材料中,形成与金属填充的开口自对准的合金区域。

著录项

  • 公开/公告号US9685407B2

    专利类型

  • 公开/公告日2017-06-20

    原文格式PDF

  • 申请/专利权人 INTERNATIONAL BUSINESS MACHINES CORPORATION;

    申请/专利号US201615260675

  • 申请日2016-09-09

  • 分类号H01L23/48;H01L23/52;H01L29/40;H01L23/528;H01L23/532;G06F17/50;H01L23/522;H01L21/02;H01L21/321;H01L21/66;H01L21/285;H01L21/288;H01L21/311;H01L21/44;H01L21/768;

  • 国家 US

  • 入库时间 2022-08-21 13:44:39

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