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Photocoupler having light receiving element, light emitting element and MOSFET on a die pad unit of a mounting member that includes terminals with multiplied conductive regions
Photocoupler having light receiving element, light emitting element and MOSFET on a die pad unit of a mounting member that includes terminals with multiplied conductive regions
A mounting member includes: an insulating substrate, a first die pad unit, first and second terminals. The insulating substrate has a rectangular first surface, a second surface, a first side surface, a second side surface, a third side surface, and a fourth side surface. A through hole is provided from the first surface to the second surface. The first die pad unit is provided on the first surface. The first terminal has a conductive region covering the first side surface, the first surface, and the second surface. The second terminal has a conductive region covering the second side surface and the second surface, connected to the first die pad unit by conductive material provided in the through hole or on a side wall of the through hole. The first die pad unit, the first terminal, and the second terminal are apart from one another.
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