首页> 外国专利> Process for producing, from an SOI and in particular an FDSOI type substrate, transistors having gate oxides of different thicknesses, and corresponding integrated circuit

Process for producing, from an SOI and in particular an FDSOI type substrate, transistors having gate oxides of different thicknesses, and corresponding integrated circuit

机译:由SOI特别是FDSOI型衬底制造具有不同厚度的栅极氧化物的晶体管的方法以及相应的集成电路

摘要

An integrated circuit includes a first zone for a first transistor and a second zone for a second transistor. The transistors are supported by a substrate of the silicon-on-insulator type that includes a semiconductor film on a buried insulating layer on a carrier substrate. In the second zone, the semiconductor film has been removed. The second transistor in the second zone includes a gate-dielectric region resting on the carrier substrate that is formed by a portion of the buried insulating layer). The first transistor in the first zone includes a gate-dielectric region formed by a dielectric layer on the semiconductor film.
机译:集成电路包括用于第一晶体管的第一区域和用于第二晶体管的第二区域。晶体管由绝缘体上硅类型的衬底支撑,该衬底包括在载体衬底上的掩埋绝缘层上的半导体膜。在第二区域中,已经去除了半导体膜。在第二区域中的第二晶体管包括靠在载体衬底上的栅极介电区,该栅极介电区由掩埋绝缘层的一部分形成。第一区域中的第一晶体管包括由介电层在半导体膜上形成的栅介电区。

著录项

  • 公开/公告号US9786755B2

    专利类型

  • 公开/公告日2017-10-10

    原文格式PDF

  • 申请/专利权人 STMICROELECTRONICS (CROLLES 2) SAS;

    申请/专利号US201514930150

  • 申请日2015-11-02

  • 分类号H01L21/84;H01L29/423;H01L27/12;H01L29/06;H01L29/08;H01L29/66;H01L29/78;H01L29/788;

  • 国家 US

  • 入库时间 2022-08-21 13:43:21

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号