首页> 外国专利> Multi-layer resin substrate having grounding conductors configured to form triplate line sections and microstrip sections

Multi-layer resin substrate having grounding conductors configured to form triplate line sections and microstrip sections

机译:具有接地导体的多层树脂基板,该接地导体被配置为形成三重线路部分和微带部分

摘要

A flat cable includes a plurality of resin layers that are flexible and stacked together, a line conductor, and grounding conductors. The flat cable includes a triplate line in which both surfaces of the line conductor oppose the corresponding grounding conductors, and a microstrip line in which only one of the surfaces of the line conductor opposes the corresponding grounding conductor. A width of the line conductor in the microstrip line is greater than a width of the line conductor in the triplate line, and the flat cable is bent at a position where the microstrip line is provided.
机译:扁平电缆包括柔性且堆叠在一起的多个树脂层,线导体和接地导体。扁平电缆包括:三条线,其中线导体的两个表面与相应的接地导体相对;以及微带线,其中线导体的仅一个表面与相应的接地导体相对。微带线中的线导体的宽度大于三板线中的线导体的宽度,并且扁平电缆在设置有微带线的位置处弯曲。

著录项

  • 公开/公告号US9692100B2

    专利类型

  • 公开/公告日2017-06-27

    原文格式PDF

  • 申请/专利权人 MURATA MANUFACTURING CO. LTD.;

    申请/专利号US201514823054

  • 发明设计人 TAKAHIRO BABA;NOBUO IKEMOTO;

    申请日2015-08-11

  • 分类号H01P3/08;H05K1/02;H01L25/10;H01L25/18;H05K1/14;

  • 国家 US

  • 入库时间 2022-08-21 13:43:10

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号