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Method of manufacturing light-emitting apparatus, light-emitting module inspecting apparatus, and method of determining whether light-emitting module meets quality requirement

机译:发光装置的制造方法,发光模块检查装置以及判断发光模块是否满足品质要求的方法

摘要

A method of manufacturing a light-emitting apparatus includes disposing a substrate on a support; disposing a light-emitting package including a light-emitting device on the substrate so as to allow the light-emitting package to be positioned at a target position on the substrate; applying energy to the light-emitting package to make the light-emitting device emit light; and analyzing the light that is emitted from the light-emitting device due to the energy, and determining a position where the light-emitting package is actually disposed. Thus, the light-emitting apparatus may be easily and inexpensively manufactured, and may generate a limited number of spots and provide improved uniform brightness.
机译:制造发光装置的方法包括:将基板布置在支撑体上;以及将基板布置在支撑体上。在基板上配置包括发光装置的发光封装体,以使发光封装体位于基板上的目标位置。向发光封装件施加能量以使发光器件发光。分析由于能量而从发光器件发射的光,并确定实际放置发光封装的位置。因此,发光装置可以容易且廉价地制造,并且可以产生有限数量的斑点并且提供改善的均匀亮度。

著录项

  • 公开/公告号US9543221B2

    专利类型

  • 公开/公告日2017-01-10

    原文格式PDF

  • 申请/专利权人 SAMSUNG ELECTRONICS CO. LTD.;

    申请/专利号US201514937347

  • 发明设计人 CHOO-HO KIM;DAE-SEO PARK;KA-RAM LEE;

    申请日2015-11-10

  • 分类号H01L21/20;H01L21/66;H01L33/58;H01L33/54;

  • 国家 US

  • 入库时间 2022-08-21 13:41:10

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