首页> 外国专利> SOLAR CELL STRUCTURE AND MANUFACTURING METHOD THEREOF USING CUBIC GALLIUM NITRIDE ON GALLIUM ARSENIDE SUBSTRATES.

SOLAR CELL STRUCTURE AND MANUFACTURING METHOD THEREOF USING CUBIC GALLIUM NITRIDE ON GALLIUM ARSENIDE SUBSTRATES.

机译:砷化镓基体上使用立方氮化镓的太阳能电池结构及其制造方法。

摘要

The present invention describes a gallium nitride solar cell structure on gallium arsenide substrates with a p-i-n-type hetero-structure, which characterizes due to being formed by (a) a GaAs layer 111 with a thickness of 1 nm to 10 nm disposed on a commercial GaAs substrate 120. (b) A p-type GaAs layer 112 with a thickness of up 100 nm to 900 nm and a carrier density in the range of up 1cm3 to 10x1019/cm3, arranged on the GaAs layer 111 cushions. (c) An un-doped intrinsic GaAs layer 113 with a thickness of up 100 nm to 2000 nm (0.1?m to 2 ?m) and a carrier density of up 1 cm3 to 10×10 16/cm3, arranged on the p-type GaAs layer 112. (d) A nucleation cubic GaN layer 114 with a thickness of up 1 nm to 10 nm, disposed on the intrinsic GaAs layer 113. And (e) an n-type cubic GaN layer 115 with a thickness of up 100 nm to 900 nm and a carrier density of up 1 cm3 to 10x1018/cm3, disposed on the cubic GaN layer 114 of nucleation.
机译:本发明描述了具有pin型异质结构的砷化镓衬底上的氮化镓太阳能电池结构,其特征在于由于由(a)设置在市售的厚度为1nm至10nm的GaAs层111形成。 GaAs衬底120。(b)布置在GaAs层111上的厚度为100nm至900nm且载流子密度为1cm3至10×1019 / cm3的p型GaAs层112缓冲。 (c)在p上设置厚度为100nm至2000nm(0.1μm至2μm),载流子密度为1cm 3至10×10 16 / cm 3的未掺杂本征GaAs层113。型GaAs层112。(d)设置在本征GaAs层113上的厚度为1 nm至10 nm的成核立方GaN层114。(e)厚度为1 nm的n型立方GaN层115设置在成核的立方GaN层114上的最大厚度为100 nm至900 nm,载流子密度为1 cm3到10x1018 / cm3。

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