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encapsulated device of semiconductor material with reduced sensitivity to thermo mechanical stress
encapsulated device of semiconductor material with reduced sensitivity to thermo mechanical stress
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机译:对热机械应力敏感度降低的半导体材料封装器件
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摘要
An encapsulated device of semiconductor material wherein a chip (56) of semiconductor material is fixed to a base element (52) of a packaging body (51) through at least one pillar element (60) having elasticity and deformability greater than the chip, for example a Young's modulus lower than 300 MPa. In one example, four pillar elements (60) are fixed in proximity of the corners of a fixing surface (56A) of the chip and operate as uncoupling structure, which prevents transfer of stresses and deformations of the base element to the chip.
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