FAST CONSTANT-TEMPERATURE FLAT HOT-EMBOSSING PROCESS FOR FORMING POLYMER MICROSTRUCTURE

摘要

Provided is a fast constant-temperature flat hot-embossing process for forming a polymer microstructure. A microstructure mold is used to perform hot-embossing on a polymer substrate at a temperature 5°C-20°C below a glass transition temperature (Tg) of an amorphous polymer to be hot-embossed, or at a temperature 10°C-50°C below a crystalline melting point (Tm) of a crystalline polymer to be hot-embossed. After the hot-embossing has been completed, the mold is directly released when the temperature thereof remains unchanged, thereby obtaining a polymer device having a surface microstructure. The process employs plastic deformation at a temperature near a glass transition temperature (Tg) or a temperature below a crystalline melting point (Tm) of a polymer in a solid state to perform microstructure formation. The mold maintains a constant temperature during the hot-embossing process so that a time consuming problem caused by repeated heating and cooling processes can be prevented, thereby realizing a fast flat hot-embossing process for forming a microstructure. Moreover, the plastic deformation is performed at a strain yield stage by controlling temperatures, thereby preventing the plastic deformation from being performed at a strain hardening stage, and ensuring a higher reproduction rate of the microstructure.