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THERMAL MANAGEMENT SOLUTIONS FOR MICROELECTRONIC DEVICES USING JUMPING DROPS VAPOR CHAMBERS
THERMAL MANAGEMENT SOLUTIONS FOR MICROELECTRONIC DEVICES USING JUMPING DROPS VAPOR CHAMBERS
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机译:使用跳跃液滴蒸气室的微电子设备热管理解决方案
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摘要
A thermal management solution may be provided for a microelectronic system, wherein a jumping drops vapor chamber is utilized between at least one microelectronic device and an integrated heat spreader. The microelectronic system may comprise a microelectronic device attached by an active surface thereof to a microelectronic substrate. The integrated heat spreader, having a first surface and an opposing second surface, is also attached to the microelectronic substrate with a jumping drops vapor chamber disposed between a back surface of the microelectronic device and the integrated heat spreader second surface. The jumping drops vapor chamber may comprise a vapor space defined by a hydrophilic evaporation surface on the microelectronic device back surface, a hydrophobic condensation surface on the integrated heat spreader second surface, and at least one sidewall extending between the hydrophilic evaporation surface and the hydrophobic condensation surface with a working fluid disposed within the vapor space.
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