METHOD FOR FULL FILLING INTER-LAYER BLIND HOLE OF HDI RIGID-FLEX LAMINATE WITH COPPER

摘要

A method for full filling an inter-layer blind hole of a HDI rigid-flex laminate with copper, comprising the steps of: 1) preparing a double-sided copper-clad laminate, and performing copper reduction on one side of the double-sided copper-clad laminate; 2) forming, by means of laser drilling, an inverted-trapezoid-shaped blind hole on the cooper-reduced side of the double-sided copper-clad laminate; 3) cleaning hole wall and hole bottom of the blind hole to remove the residue left during drilling on the hole wall and at the hole bottom; 4) deposing a metal copper layer on the surface of the hole wall and hole bottom of the blind hole; 5) full filing the blind hole, which is deposited with the metal copper layer, with copper, thereby achieving inter-layer connection of the HDI rigid-flex laminate. Accordingly, the inter-layer blind hole of the HDI rigid-flex laminate is full filled with copper, ensuring the inter-layer conductivity of the blind hole, increasing the wiring density of the HDI rigid-flex laminate, reducing the investment cost of the device, and improving the production efficiency and production benefits.