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MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES CONNECTED WITH A MICROELECTRONIC BRIDGE EMBEDDED IN A MICROELECTRONIC SUBSTRATE
MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES CONNECTED WITH A MICROELECTRONIC BRIDGE EMBEDDED IN A MICROELECTRONIC SUBSTRATE
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机译:具有多个微电子结构的微电子结构,该微电子结构与嵌入在微电子基板中的微电子桥相连
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摘要
A microelectronic structure includes a microelectronic substrate having a first surface and a cavity extending into the substrate from the microelectronic substrate first surface, a first microelectronic device and a second microelectronic device attached to the microelectronic substrate first surface, and a microelectronic bridge disposed within the microelectronic substrate cavity and attached to the first microelectronic device and to the second microelectronic device. In one embodiment, the microelectronic structure may include a reconstituted wafer formed from the first microelectronic device and the second microelectronic device. In another embodiment, a flux material may extend between the first microelectronic device and the microelectronic bridge and between the second microelectronic device and the microelectronic bridge.
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