ELECTRONIC COMPONENT MOUNTING STRUCTURE, ELECTRONIC COMPONENT, AND METHOD FOR FORMING ELECTRONIC COMPONENT MOUNTING STRUCTURE

摘要

To provide an electronic component mounting structure having high migration resistance, and high mounting strength with respect to a substrate.Disclosed is an electronic component mounting structure wherein solder fillets 17 connecting land electrodes 6a, 6b and external electrodes 3a, 3b to each other are formed, and furthermore, a coating resin layer 4 having migration suppressing functions is provided. The coating resin layer 4 covers , out of the four side surfaces of an electronic component 1, three side surfaces excluding a side surface facing a main surface of a substrate, and covers a pair of end surfaces of the electronic component 1 together with the external electrodes and the solder fillets 17 , and the coating resin layer 4 is not in contact with a main surface of a substrate 5, or in contact with, merely in the vicinity of the electronic component 1, the main surface of the substrate 5.