PLATING PROCESS FOR SUBSTRATE, SUBSTRATE FOR THERMOELECTRIC ELEMENT USING PLATING PROCESS AND THERMOELECTRIC ELEMENT HAVING SUBSTRATE

摘要

Disclosed is a method for plating a substrate, capable of forming a gold plating layer by selectively depositing gold only on a portion coated with copper without eduction of gold on the surface of a non-conductor such as ceramic which is not coated with copper in a non-conductive substrate such as ceramic. Nickel can readily penetrate between Au atoms, so an Au-Ni-Sn-Pb (gold-nickel-tin-lead) alloy layer can be easily formed during soldering, so that excellent soldering property (adhesion, pulling, strength, etc.) can be achieved. The substrate plating method includes: a substrate preparation step to prepare a non-conductive substrate having a surface of a copper layer coated with copper as well as a surface of a non-conductor on which copper is not coated; a nickel plating step to form a nickel layer by plating the surface of the copper layer with nickel; and an electroless displacement gold plating step to form a gold plating plate by educting gold only on a surface of the nickel layer without educting gold on a surface of the non-conductor which is not coated with copper by immersing the non-conductive substrate formed with the nickel layer in an electroless displacement gold plating solution having no reducing agent.;COPYRIGHT KIPO 2017