inter-chip power connection in multi-chip system power distribution network and method of mitigating power noise

摘要

According to one embodiment, an inter-chip power connection unit in a multi-chip system comprises a transmission line which connects a first on-die power grid of a first die to a second on-die power grid of a second die. The first die and the second die share the same first conductive layer for supplying a power voltage of a power supplier. The transmission line is not directly connected to the first conductive layer.