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Multi-chip package (MCP) having three dimensional mesh-based power distribution network, and power distribution method of the MCP
Multi-chip package (MCP) having three dimensional mesh-based power distribution network, and power distribution method of the MCP
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机译:具有基于三维网格的配电网络的多芯片封装(MCP)及其MCP的配电方法
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摘要
A MCP includes a plurality of semiconductor memory devices, the plurality of semiconductor memory devices being stacked to define a three-dimensional (3D) structure, and a mesh structure, the mesh structure interconnecting the plurality of semiconductor memory devices to define a 3D mesh-based power distribution network.
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