AQUEOUS COPPER COLLOID CATALYST SOLUTION AND ELECTROLESS COPPER PLATING METHOD FOR THE ELECTROLESS COPPER PLATING

摘要

(A), (B), (C), and (C) a colloidal stabilizer, wherein the components (A) and (C) are contained in a solution containing a surfactant, And the electroless copper plating is carried out by applying a catalyst to a non-conductive substrate with an aqueous copper colloid catalyst solution for electroless copper plating containing no surfactant or a small amount of surfactant, The stability with time is good. In addition, since the catalytic activity is enhanced by the adsorption promoting pretreatment, the catalyst is applied and the electroless plating is performed, which is excellent in the uniformity of the deposited copper film and prevention of occurrence of uneven deposition.