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MULTILAYER HIGH-CONDUCTION PRINTED ELECTRONIC CIRCUIT MATERIAL AND METHOD FOR MANUFACTURING STRETCHABLE EMBEDDED CIRCUIT BOARD USING SAME
MULTILAYER HIGH-CONDUCTION PRINTED ELECTRONIC CIRCUIT MATERIAL AND METHOD FOR MANUFACTURING STRETCHABLE EMBEDDED CIRCUIT BOARD USING SAME
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机译:多层高导印刷电子电路材料及使用该电路板制造可拉伸嵌入式电路板的方法
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摘要
The present invention relates to a multilayer high-conduction printed electronic circuit material and a method for manufacturing a flexible embedded circuit board using the same. According to the present invention, a flexible and stretchable circuit board with an embedded form is provided by transferring an electronic circuit printed on a substrate into a liquidity polymer with flexibility, stretchability and transparency. According to the present invention, by embedding a printed circuit board in the liquidity polymer after printing the printed circuit board on a sacrificial substrate by using the sacrificial substrate and firstly sintering the printed circuit board, the de-lamination of the printed circuit board can be prevented and provided is the stretchable embedded printed circuit board with high reliability without damage to the substrate.;COPYRIGHT KIPO 2017
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