首页> 外国专利> MULTILAYER HIGH-CONDUCTION PRINTED ELECTRONIC CIRCUIT MATERIAL AND METHOD FOR MANUFACTURING STRETCHABLE EMBEDDED CIRCUIT BOARD USING SAME

MULTILAYER HIGH-CONDUCTION PRINTED ELECTRONIC CIRCUIT MATERIAL AND METHOD FOR MANUFACTURING STRETCHABLE EMBEDDED CIRCUIT BOARD USING SAME

机译:多层高导印刷电子电路材料及使用该电路板制造可拉伸嵌入式电路板的方法

摘要

The present invention relates to a multilayer high-conduction printed electronic circuit material and a method for manufacturing a flexible embedded circuit board using the same. According to the present invention, a flexible and stretchable circuit board with an embedded form is provided by transferring an electronic circuit printed on a substrate into a liquidity polymer with flexibility, stretchability and transparency. According to the present invention, by embedding a printed circuit board in the liquidity polymer after printing the printed circuit board on a sacrificial substrate by using the sacrificial substrate and firstly sintering the printed circuit board, the de-lamination of the printed circuit board can be prevented and provided is the stretchable embedded printed circuit board with high reliability without damage to the substrate.;COPYRIGHT KIPO 2017
机译:多层高导电印刷电路材料及其制造方法技术领域本发明涉及一种多层高导电印刷电路材料及其制造方法。根据本发明,通过将印刷在基板上的电子电路转移到具有柔性,可拉伸性和透明性的流动性聚合物中,来提供具有嵌入形式的柔性和可拉伸电路板。根据本发明,通过在使用牺牲基板将印刷电路板印刷到牺牲基板上之后首先将印刷电路板嵌入到流动性聚合物中,并且首先烧结印刷电路板,可以印刷电路板的分层。防止并提供了一种可拉伸的嵌入式印刷电路板,该电路板具有高可靠性而不会损坏基板。; COPYRIGHT KIPO 2017

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