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ACCELERATION SENSOR APPARATUS USING MATERIAL CHARACTERISTICS OF BONDING WIRE AND ACCELERATION SENSING METHOD THEREOF

机译:利用键合线材料特性的加速度传感器装置及其加速度传感方法

摘要

Disclosed is an acceleration sensor apparatus, which does not require an MEMS process when in a process of manufacturing the acceleration sensor apparatus so as to reduce manufacturing cost and reduce power consumption of the acceleration sensor apparatus. The acceleration sensor apparatus comprises: a circuit board; first and second bonding pad parts symmetrically formed on one surface of the circuit board; first and second bonding wires having both ends connected to the first and second bonding pad parts; and a processor calculating acceleration from a change in capacitance between the first and second bonding wires generated depending on movement of the circuit board.;COPYRIGHT KIPO 2017
机译:公开了一种加速度传感器设备,当在制造加速度传感器设备的过程中时,不需要MEMS工艺,从而降低了制造成本并降低了加速度传感器设备的功耗。加速度传感器装置包括:电路板;第一和第二焊盘部分对称地形成在电路板的一个表面上;第一和第二键合线的两端连接到第一和第二键合焊盘部分。处理器;以及处理器,根据电路板的运动,根据第一键合线和第二键合线之间的电容变化来计算加速度。; COPYRIGHT KIPO 2017

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