ACCELERATION SENSOR APPARATUS USING MATERIAL CHARACTERISTICS OF BONDING WIRE AND ACCELERATION SENSING METHOD THEREOF

摘要

Disclosed is an acceleration sensor apparatus, which does not require an MEMS process when in a process of manufacturing the acceleration sensor apparatus so as to reduce manufacturing cost and reduce power consumption of the acceleration sensor apparatus. The acceleration sensor apparatus comprises: a circuit board; first and second bonding pad parts symmetrically formed on one surface of the circuit board; first and second bonding wires having both ends connected to the first and second bonding pad parts; and a processor calculating acceleration from a change in capacitance between the first and second bonding wires generated depending on movement of the circuit board.;COPYRIGHT KIPO 2017