ACCELERATION SENSOR APPARATUS AND ACCELERATION SESING METHOD USING BONDWIRE'S MATERIAL CHARACTERISTICS

摘要

An acceleration sensor device is disclosed. The acceleration sensor device includes a circuit board, first and second bonding pad portions symmetrically formed on one surface of the circuit board, first and second bonding wires connected at both ends to the first and second bonding pad portions, And a processor for calculating an acceleration from a change in capacitance between the first and second bonding wires caused by movement of the circuit board.;