LED Driver chip on chip package device for smart LED Driver

摘要

According to an aspect of the present invention, provided is a chip-on-chip package device for a smart LED driver, which includes: a package substrate connected to an external lead pin; a PFC power MOSFET chip mounted on the package substrate with an SiO2 solder material and including a function to output an inputted DC voltage as a DC voltage of a predetermined magnitude through a power factor correction; and a control driver IC chip mounted and bonded on the upper side of the PFC power MOSFET chip with the SiO2 solder material and including a function to control the operation of the PFC power MOSFET chip according to a control condition by receiving a feedback signal of an LED lamp load, and is packaged as one semiconductor device. A distance between the PFC power MOSFET chip and the control driver IC chip is 2 um. Accordingly, the present invention can be universally used in an LED illumination field.