Multi-port optical probes for photonic IC characterization and packaging

摘要

Improved passive optical coupling to photonic integrated circuit (PIC) chips is provided. An interposer unit 108 having one or more flexible optical waveguide members 112, 114, 116 is employed. The flexible optical waveguide members are coupled to the PIC chip 118 through their respective tips. The PIC chip includes alignment features to enable lateral, vertical, and longitudinal passive alignment of the flexible optical waveguide members to the on-chip optical waveguides of the PIC chip.;