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Multi-port optical probe for photonic IC characterization and packaging

机译：用于光子IC表征和封装的多端口光学探头

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摘要

Improved passive optical coupling to photonic integrated circuit (PIC) chips is provided. An interposer unit (108) having one or more flexible optical waveguide members (112, 114, 116) is employed. The flexible optical waveguide members are coupled to the PIC chip (118) via their tips. The PIC chip includes alignment features to facilitate lateral, vertical and longitudinal passive alignment of the flexible optical waveguide members to on-chip optical waveguides of the PIC.

机译：提供了到光子集成电路（PIC）芯片的改进的无源光耦合。使用具有一个或多个柔性光波导构件（ 112、114、116 ）的插入器单元（ 108 ）。柔性光波导部件通过其尖端耦合到PIC芯片（ 118 ）。 PIC芯片包括对准特征，以促进柔性光波导构件与PIC的芯片上光波导的横向，垂直和纵向无源对准。 展开▼

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公开/公告号US2018024299A1

专利类型

公开/公告日2018-01-25

原文格式PDF

申请/专利权人 TECHNISCHE UNIVERSITEIT EINDHOVEN;
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申请/专利号US201615551674

发明设计人 XAVERIUS JACQUES MARIA LEIJTENS;RUI MANUEL LEMOS ALVARES DOS SANTOS;
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申请日2016-02-18

分类号G02B6/30;G02B6/14;G02B6/42;G02B6/36;G02B6/26;

国家 US

入库时间 2022-08-21 13:01:43

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