POLYPHENYL ETHER RESIN COMPOSITE AND PREPREG AND COPPER CLAD LAMINATE MADE OF POLYPHENYL ETHER RESIN COMPOSITE

摘要

Polyphenyl ether resin composition, and a semi-cured sheet and a copper-clad laminate produced using the same. The composition of the polyphenyl ether resin composition includes (A) a functionalized polyphenyl ether resin, (B) a crosslinking curing agent and (C) an initiator, wherein the functionalized polyphenyl ether resin of the composition (A) (B) a crosslinking curing agent is an olefin resin having a number average molecular weight of 50 to 10000 and a styrene structure in a weight ratio of 10% to 50%, wherein the crosslinking curing agent is a polyphenylene ether resin having an unsaturated double bond at the terminal of the molecule, The molecular weight includes a butadiene structure additionally reacted at positions 1 and 2. The polyphenyl ether resin composition is a low molecular weight functionalized polyphenyl ether resin composition and has good processability, maintains good dielectric properties and heat resistance of the polyphenyl ether resin, and the semi-cured sheet and the copper-It has dielectric properties and heat resistance, and is applied to high frequency and high speed printed circuit boards, and is suitable for processing multilayer printed circuit boards.