CATALYST APPLICATION SOLUTION ELECTROLESS PLATING METHOD USING SAME AND DIRECT PLATING METHOD

摘要

Characterized in that it contains a water-soluble palladium compound, a reducing agent, a dispersant, a catechol, a copper antioxidant, and a buffer, and has a pH of 4 or more as a catalyst-imparting solution for plating the insulating portion of the insulating-As compared with the Pd-Sn colloid solution, since it is a colloidal solution of Pd alone containing no Sn, the pre-dip treatment and the Sn removal treatment become unnecessary, the catalyst application treatment can be simplified, and the pH 4 or more, haloing does not occur, copper surface is not oxidized in the reducing atmosphere by the reducing agent in the catalyst-imparting solution, copper dissolution does not occur, and thus palladium substitution reaction does not occur.