Method of removing oxide film and sputtering apparatus used in the same method of manufacturing electronic device using method of removing oxide film and electronic device formed by applying method of removing oxide film

摘要

A method for removing an oxide film according to an embodiment of the present invention includes the steps of mounting a substrate including an element having an oxide film on a substrate holder of a sputtering apparatus and mounting the oxide film on the substrate holder to expose the oxide film, The oxide film is removed. The substrate may comprise a portion of a magnetic tunnel junction (MTJ) device, a portion of a spin device, or a portion of a nanowire device. The substrate holder may further include control means for controlling the surface roughness of the surface from which the oxide film has been removed.;