首页> 外国专利> METHOD FOR FORMING SILICON OXYNITRIDE FILM AND SUBSTRATE HAVING SILICON OXYNITRIDE FILM PRODUCED USING THIS FORMATION METHOD

METHOD FOR FORMING SILICON OXYNITRIDE FILM AND SUBSTRATE HAVING SILICON OXYNITRIDE FILM PRODUCED USING THIS FORMATION METHOD

机译:形成硅氧化膜的方法和使用该形成方法生产的具有硅氧化膜的基质

摘要

The present invention provides a method of manufacturing a silicon oxynitride film capable of suppressing energy cost and a substrate having a silicon oxynitride film produced by the method. The above-mentioned method comprises a step of applying a film-forming composition containing a polysilazane compound to the surface of a substrate to form a coating film, a step of removing excess solvent contained in the coating film, and a step of removing the solvent from the coating film And a step of irradiating ultraviolet rays under the temperature condition of RTI ID = 0.0
机译:本发明提供一种能够抑制能量成本的氮氧化硅膜的制造方法以及具有通过该方法制造的氮氧化硅膜的基板。上述方法包括以下步骤:将包含聚硅氮烷化合物的成膜组合物施涂到基材的表面上以形成涂膜;去除所述涂膜中包含的过量溶剂的步骤;以及去除所述溶剂的步骤。从涂膜中得到的步骤和在温度条件下辐照紫外线的步骤

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