首页> 外国专利> COVER TAPE FOR ELECTRONIC PART PACKAGE PACKAGING MATERIAL FOR ELECTRONIC PART PACKAGE AND ELECTRONIC PART PACKAGE

COVER TAPE FOR ELECTRONIC PART PACKAGE PACKAGING MATERIAL FOR ELECTRONIC PART PACKAGE AND ELECTRONIC PART PACKAGE

机译:电子零件包装用包装带电子零件包装用包装材料

摘要

There is provided a cover tape which can be used as an electronic part packaging packaging material capable of taking out electronic parts from within a recess provided in a carrier tape with excellent accuracy. Wherein the heat sealant layer has a surface roughness Rz (defined in JIS B 0601) of not less than 1.0 탆 and a polyorganosiloxane as a main component Wherein the adhesive strength to the resin layer is 0.3 g / mm 2 or less.
机译:提供一种可用作电子部件包装包装材料的覆盖带,其能够以优异的精度从设置在载带中的凹部内取出电子部件。其中,热封层的表面粗糙度Rz(JIS B 0601规定)为1.0 1.0以上,并且以聚有机硅氧烷为主要成分,对树脂层的粘接强度为0.3g / mm 2 2 或更少。

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