Cover tape for electronic component packaging, packaging material for electronic component packaging, and electronic component package

摘要

One object of the present invention is to provide a cover tape that can be used as a packaging material for packaging an electronic component capable of taking out an electronic component from a concave portion of the carrier tape with excellent accuracy. And a heat sealant layer laminated on one surface of the base material layer and sealed by the carrier tape. The heat sealant layer has a surface roughness Rz (specified in JIS B 0601) of 1. Provided is a cover tape for packaging electronic parts, characterized in that the adhesive strength with a resin layer containing polyorganosiloxane as a main component is 0 g or more and 0.3 g / mm 2 or less.