Multi-functional multilayer printed circuit boards with an electrically conductive high-current conductive structure and method of manufacture

摘要

Multifunctional multilayer printed circuit board (1) with an electrically conductive structure (3, 15) of etched conductor tracks (3) and profiled tapes (6, 7, 22, 27, 32, 33, 34) mechanically and electrically conductively attached thereon, with high current-conducting properties, wherein the profiled tapes (6, 7, 22, 27, 32, 33, 34) are formed of individual mutually parallel wire elements, so that the wire elements are electrically conductively connected to each other and form profile strips with Hochstromleiteigenschaften, and with the conductive structure (3, 15) of the Multi-layer printed circuit board (1) are electrically conductively connected by welding, wherein a.) The welding of the profiled strips (6, 7, 22, 27, 32, 33, 34) on the conductive structure (3, 15) of the multilayer printed circuit board (1) by a Ultrasonic welding and / or friction welding with at least piecewise flat intermetallic compound (14) takes place and b.) The wire elements transverse to their longitudinal extent c.) in the transverse direction of the individual wire elements intermetallic compounds (14) between the wire elements and the conductor track (3) are formed and d.) The intermetallic compounds (14) consist of the molten copper material of the wire elements and e.) The profiled strips (6, 7, 22, 27, 32, 33, 34) are electrically conductively connected in the direction of their longitudinal extension over their entire length to the conductive structure (3, 15) of the multilayer printed circuit board (1) by welding.