Multi-functional multilayer printed circuit board for handbook, has wire elements electric conductively interconnected with electrically conductive structure of board by welding process e.g. ultrasonic welding process

摘要

The board (1) has an electrically conductive structure including corroded conductive paths (3, 53). Mechanically and electrically conductively attached profile tapes are provided with high current guidance properties. The profile tapes are formed from wire elements that are individually arranged parallel to each other and conductively connected with each other. The wire elements are electric conductively interconnected with the conductive structure of the board by welding process e.g. ultrasonic welding process and/or friction welding process. An independent claim is also included for a method for establishing multi-functional multilayer printed circuit board.