首页> 外国专利> RADIATION-EMITTING SEMICONDUCTOR BODY, METHOD FOR PRODUCING A RADIATION-EMITTING SEMICONDUCTOR BODY, AND RADIATION-EMITTING SEMICONDUCTOR COMPONENT

RADIATION-EMITTING SEMICONDUCTOR BODY, METHOD FOR PRODUCING A RADIATION-EMITTING SEMICONDUCTOR BODY, AND RADIATION-EMITTING SEMICONDUCTOR COMPONENT

机译:辐射辐射型半导体本体,辐射辐射型半导体本体的制造方法以及辐射辐射型半导体元件

摘要

A method is disclosed for producing a radiation-emitting semiconductor body (14) with the following steps: Providing an epitaxial semiconductor layer sequence (3) having an active zone (4) which is suitable for generating electromagnetic radiation, - applying a carrier layer (1) on a main side of the epitaxial semiconductor layer sequence (3), wherein the carrier layer (1) for the mechanical stabilization of the epitaxial semiconductor layer sequence (3) is provided Applying a joinable layer (11), - Forming of contact structures (9) by means of photolithography on the carrier layer (1), wherein the contact structures (9) each have a volume region (12) and a Oberflächenfügebereich (13) and wherein the contact structures are arranged on a back of the semiconductor body, which is a radiation-emitting Front is opposite characterized in that between the carrier layer (1) and the joinable layer (11), a further layer (10) made of the same material as the carrier layer (1) is applied.;Furthermore, a semiconductor body (14) and a component with a semiconductor body (14) are specified.
机译:公开了一种用于制造发射辐射的半导体本体(14)的方法,该方法具有以下步骤:提供具有适于产生电磁辐射的有源区(4)的外延半导体层序列(3),-施加载体层( 1)在外延半导体层序列(3)的主面上,其中提供用于机械稳定外延半导体层序列(3)的载体层(1)。施加可接合层(11),-形成接触通过光刻在载体层(1)上形成结构(9),其中接触结构(9)分别具有一个体积区域(12)和一个Oberflächenfügebereich(13),并且其中接触结构布置在半导体的背面与作为辐射发射面的主体相反,其特征在于,在载体层(1)和可接合层(11)之间,施加由与载体层(1)相同的材料制成的另一层(10)。 ;进一步矿石是半导体本体(14)和具有半导体本体(14)的部件。

著录项

  • 公开/公告号EP3349260A1

    专利类型

  • 公开/公告日2018-07-18

    原文格式PDF

  • 申请/专利权人 OSRAM OPTO SEMICONDUCTORS GMBH;

    申请/专利号EP20180158977

  • 发明设计人 BRUNNER HERBERT;NINZ PATRICK;

    申请日2011-06-08

  • 分类号H01L33/62;H05K3/32;H01L23;H01L33/38;H01L33;

  • 国家 EP

  • 入库时间 2022-08-21 13:16:56

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